Russian Scientists Develop Breakthrough Tech for Domestic Microelectronics

A team at Tomsk State University has pioneered a new way to make ultra-fine powders used in chip manufacturing—cutting reliance on imports and improving quality.

Students from Tomsk State University have achieved a breakthrough in microelectronics by developing a novel method for producing ultra-fine powders used in the casing of integrated circuits.

Until now, these materials had to be imported. According to the university’s press office, the new technology will allow Russia’s tech industry to source these critical components domestically.

The researchers succeeded in creating powders with particle sizes under one micrometer. This advancement improves the quality of conductive layers in microchips, making metallized layers up to twice as thin as those formed with standard pastes.

The project has already received backing from the Foundation for Assistance to Small Innovative Enterprises. Experts believe this innovation could significantly reduce Russia’s dependency on foreign microelectronics and strengthen the competitiveness of local manufacturers.